Principal Physical Design Engineer, HBM
Company: Micron
Location: Richardson
Posted on: March 30, 2026
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Job Description:
Job Description Our vision is to transform how the world uses
information to enrich life for all. Micron Technology is a world
leader in innovating memory and storage solutions that accelerate
the transformation of information into intelligence, inspiring the
world to learn, communicate and advance faster than ever.
Responsibilities - Lead end?to?end physical design for High
Bandwidth Memory (HBM) base and memory dies from netlist through
GDSII, including floorplanning, power planning, placement, clock
tree synthesis, routing, and signoff. - Define and drive
HBM?specific physical architecture, including channel partitioning,
physical layer (PHY) placement, through?silicon via (TSV) keep?out
regions, and die?package co?design alignment. - Optimize bandwidth,
latency, power, and yield through architecture?level tradeoffs and
collaboration with memory architecture, PHY, RTL, synthesis,
design?for?test, and packaging teams. - Lead power delivery network
design and ensure IR drop, electromigration, and thermal closure
across all operating modes. - Oversee timing closure across corners
for high?speed logic and HBM PHY interfaces, addressing signal
integrity, noise, and crosstalk. - Ensure physical signoff
readiness, including static timing analysis, IR/EM, signal
integrity, design rule checks, layout versus schematic, density,
and reliability compliance. - Drive engineering change order
strategies, flow improvements, automation, and methodology
development for HBM physical design. - Mentor engineers and serve
as a key technical voice in tape?out and executive design reviews.
Minimum Qualifications - Bachelor’s degree or Master’s degree in
Electrical Engineering, Computer Engineering, or a related field,
or equivalent professional experience. - 12 years of hands?on
experience in advanced?node physical design with proven tape?out
experience in HBM, dynamic random?access memory (DRAM), or large
memory?centric designs. - Deep expertise in floorplanning,
hierarchical physical design, timing closure, static timing
analysis, power integrity (IR/EM), thermal analysis, and physical
signoff. - Expert?level experience with Cadence Innovus and/or
Synopsys ICC2 or Fusion Compiler, plus experience with Voltus,
RedHawk, or equivalent power integrity tools. - Familiarity with
Calibre design rule checking, layout versus schematic, and advanced
foundry signoff flows. Preferred Qualifications - Experience with
HBM2E, HBM3, or HBM3E products and TSV?based designs, including
micro?bump layouts. - Knowledge of die?to?die interfaces, wide
parallel buses, and advanced packaging such as 2.5D interposers and
chiplets. - Background in signal integrity considerations for
dense, high?speed memory designs. - Strong Tcl or Python scripting
skills for physical design flow automation. - Experience supporting
system?level integration with graphics processing units,
accelerators, or system?on?chips. As a world leader in the
semiconductor industry, Micron is dedicated to your personal
wellbeing and professional growth. Micron benefits are designed to
help you stay well, provide peace of mind and help you prepare for
the future. We offer a choice of medical, dental and vision plans
in all locations enabling team members to select the plans that
best meet their family healthcare needs and budget. Micron also
provides benefit programs that help protect your income if you are
unable to work due to illness or injury, and paid family leave.
Additionally, Micron benefits include a robust paid time-off
program and paid holidays. For additional information regarding the
Benefit programs available, please see the Benefits Guide posted on
micron.com/careers/benefits. Micron is proud to be an equal
opportunity workplace and is an affirmative action employer. All
qualified applicants will receive consideration for employment
without regard to race, color, religion, sex, sexual orientation,
age, national origin, citizenship status, disability, protected
veteran status, gender identity or any other factor protected by
applicable federal, state, or local laws. To learn about your right
to work click here. To learn more about Micron, please visit
micron.com/careers For US Sites Only: To request assistance with
the application process and/or for reasonable accommodations,
please contact Micron’s People Organization at
hrsupport_na@micron.com or 1-800-336-8918 (select option 3) Micron
Prohibits the use of child labor and complies with all applicable
laws, rules, regulations, and other international and industry
labor standards. Micron does not charge candidates any recruitment
fees or unlawfully collect any other payment from candidates as
consideration for their employment with Micron. AI alert:
Candidates are encouraged to use AI tools to enhance their resume
and/or application materials. However, all information provided
must be accurate and reflect the candidate's true skills and
experiences. Misuse of AI to fabricate or misrepresent
qualifications will result in immediate disqualification. Fraud
alert: Micron advises job seekers to be cautious of unsolicited job
offers and to verify the authenticity of any communication claiming
to be from Micron by checking the official Micron careers website
in the About Micron Technology, Inc.
Keywords: Micron, Frisco , Principal Physical Design Engineer, HBM, Engineering , Richardson, Texas